Transient liquid phase bonding technique and its applications in metallurgy
Mardi 15 octobre 2013 14:00
- Duree : 1 heure
Lieu : Salle des Séminaires du LMGP (M2-20), 2ème étage, Bât Phelma MINATEC - 3 parvis Louis Néel - 38000 Grenoble
Orateur : Nicolas DI LUOZZO (PhD student - LMGP & Laboratorio de Sólidos Amorfos, Universidad de Buenos Aires - Argentina)
Transient liquid phase bonding (TLPB) provides a method of joining difficult-to-weld materials by standard industrial arc welding processes. In TLPB, a liquid phase - of specific chemical composition - is formed in between the parts to be joined, at a temperature below their melting point. Thanks to the interdiffusion of alloying elements across the solid-liquid interface, solidification of the liquid phase takes place, carrying out the joint.
A thorough description of the TLPB process will be given, along with our work in joining steel structural members with a variety of filler materials, from amorphous Fe-based to pure Cu foils. Results from both the microstructural and mechanical properties characterization will be presented, showing their potential as a novel joining technique.
More info : http://www.lmgp.grenoble-inp.fr/le-laboratoire/lmgp-seminar-n-di-luozzo-transient-liquid-phase-bonding-technique-and-its-applications-in-metallurgy-557054.kjsp?RH=LMGP_Actualites
Contact : colette.lartigue@minatec.inpg.fr
Discipline évènement : (Physique)
Entité organisatrice : (LMGP)
Nature évènement : (Séminaire)
Evènement répétitif : (Séminaire LMGP)
Site de l'évènement : Site Minatec
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