Multi-function and multi-dimension integration for future wireless systems and applications

Orateur : Ke WU (Dept. of Electrical Engineering, Ecole Polytechnique, University of Montreal, Canada)

Recent research and development of hardware architectures and technologies over MHz-through-THz frequency range have generated a si gnificant momentum for future wireless applications. This leap forward is being propelled by the organic fusion of multiple functional and multiple dimensional transceiver integration based on multiple technologies through heterogeneous materials and innovative processes. This presentation begins with the overview of fundamental wireless functionalities. Emerging advances in multifunction, multimaterial, multilayer and multiband wireless technologies are reviewed. Technological roadmap is highlighted with reference to enabling and building technological elements, ranging from current and emerging compound materials to evolving and beyond CMOS, and from developing substrate integrations to future electromagnetic techniques. The talk also provides a brief tour of the state-of-the-art wireless devices, antennas, circuits and systems. Challenging issues and future directions of wireless technologies including 5G and beyond are discussed.

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