A completely new approach to the development of wireless microwave systems is required by the advent of Internet of Things (IoT). The next generation o f microwave systems demands a technology that guarantees easy integration of complex wireless nodes, combination of multiple functions in a single device, low development cost, compact size and low weight. Among the available technologies for the implementation and integration of microwave components and systems, the substrate integration waveguide (SIW) technology looks a very suitable approach, able to satisfy the requirements of the future IoT systems. In fact, SIW technology allows to implement a variety of passive components, active subsystems, and antennas in a simple and cost-effective way, and to integrate entire systems in a single dielectric substrate, thus avoiding complex transitions and undesired parasitic effects. Different solutions can be adopted to reduce the size and increase the bandwidth of SIW structures, ranging slab and ridge SIW interconnects to half-mode and quarter-mode configurations. These solutions provide a substantial reduction in the circuit size, whi le retaining the major advantages of SIW technology. Moreover, the choice of the substrate material represents another key point for IoT systems : in fact, depending on the specific application, different requirements are posed. The use of paper, for instance, guarantees the implementation of eco-friendly systems (required in specific fields, e.g., agriculture), a very low material cost, and structure conformability. The use of textile, on the other hand, appears very suitable for the implementation of wearable systems, which can be directly integrated into garments (important, e.g., in biomedical applications). Finally, additive manufacturing techniques like 3D printing represent a rapidly emerging area, which allows the low-cost and ease manufacturing of fully three-dimensional structures. This presentation will cover the perspectives of microwave systems in the new scenario of the IoT, with particular emphasis on implementation of SIW components and antennas with different features and substrate materials.

http://imep-lahc.grenoble-inp.fr/seminars/seminar-of-maurizio-bozzi-851167.kjsp?RH=IMEP_FR

Contact : bauza@minatec.grenoble-inp.fr