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Workshop on Characterization and Metrology for 3D CMOS
Vendredi 15 mars 2019 08:30 - Duree : 8 heures 30 minutesLieu : Maison Minatec, 3 rue Parvis Louis Néel, Grenoble
Orateur : Maud VINET (LETI), Ehrenfried ZSCHECH (Fraunhofer Institute), Delphine LE CUNFF (ST), Zineb SAGHI (LETI), Igor TUROVETS (NOVA)
As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major me trology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM “3D Advanced Metrology and materials for advanced devices” is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials. Free Registration via YurPlan : https://yurplan.com/event/3rd-3-DAM-Workshop/34875?inwidget=&culture=en Contact : vincent.delaye@cea.fr
Entité organisatrice : (LETI)
Nature évènement : (Workshop / Symposium)
Site de l'évènement : Site Minatec
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