Buckling Delamination of Thin Films Deposited on Substrates

Orateur : Guillaume PARRY (SIMAP, CNRS – Grenoble INP – Univ. Grenoble Alpes)

Thin films and coatings are widely used in many technological applications (mechanical systems, optical systems or microelectronic devices). High internal stresses are often measured, typically about a few Gigapascals, in compression when the coatings are prepared by physical vapor deposition (PVD). The films are then susceptible to undergo "buckling delamination" (i.e. delaminate from the substrate while buckling), which leads to complex delamination patterns on the free surfaces of the materials. We will discuss the modelling of these buckling delamination phenomena, and show in particular how the propagation of "telephone cords" blisters, the most frequently observed on coatings, was recently understood by using numerical simulation by the finite elements method and the use of cohesive zone models. Understanding this phenomenon provides indirect access to the adhesion energy of the films. We will also discuss the phenomenon of blistering occurring for thin films deposited on soft substrates, and we will see in particular how the softness of the substrate modifies the delamination mechanism and promotes the interaction between blistering structures.

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